The success of signal integrity in PCB design depends on handling bottlenecks such as reflection, crosstalk, delay, and impedance matching. These problems are the result of increasing data rates at the Input/output and memory interfaces, and due to the high-speed transceiver technologies that are embedded into FPGAs and PCBs.
The need for high-speed digital circuits is increasing every year, and also the demand for reliable high-speed PCB. The digital PCB circuits are compactly packed with microprocessors, power supply and many other components that are operating at frequencies easily over 1 GHz. These systems are capable of managing billions and billions of operations every second. The performance of this setup relies on the effort made during the design stage to optimize any issues that may arise due to high-speed operation.